Robotic Microassembly

327 Pages·6.73 MB·english

by  Gauthier M.

ROBOTIC
MICROASSEMBLY
Editedby
MICHAE¨L GAUTHIER
STE´PHANE RE´GNIER
IEEEPRESS
AJOHNWILEY&SONS,INC.,PUBLICATION

ROBOTIC
MICROASSEMBLY
IEEE Press
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Kenneth Moore, Directorof IEEE Book and Information Services(BIS)
ROBOTIC
MICROASSEMBLY
Editedby
MICHAE¨L GAUTHIER
STE´PHANE RE´GNIER
IEEEPRESS
AJOHNWILEY&SONS,INC.,PUBLICATION
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LibraryofCongressCataloging-in-PublicationData:
Gauthier,Michae¨l,1975-
Roboticmicro-assembly/Michae¨lGauthier,Ste´phaneRe´gnier.
p.cm.
Includesbibliographicalreferencesandindex.
ISBN978-0-470-48417-3(cloth:alk.paper)1.Robotics.2.Robots,Industrial.
3.Microfabrication.I.Regnier,Stephane.II.Title.
TJ211.G3782010
670.42(cid:1)72–dc22
2009054236
PrintedintheUnitedStatesofAmerica
10 9 8 7 6 5 4 3 2 1
CONTENTS
FOREWORD xi
PREFACE xiii
CONTRIBUTORS xvii
I MODELING OF THE MICROWORLD
1 MICROWORLDMODELINGINVACUUMANDGASEOUS
ENVIRONMENTS 3
PierreLambertandSte´phaneRe´gnier
1.1 Introduction / 3
1.1.1 Introduction on Microworld Modeling / 3
1.1.2 Microworld Modeling for Van der Waals Forces and
Contact Mechanics / 5
1.2 Classical Models / 6
1.2.1 Van der Waals Forces / 6
1.2.2 Capillary Forces / 17
1.2.3 Elastic Contact Mechanics / 34
1.3 Recent Developments / 36
1.3.1 Capillary Condensation / 36
1.3.2 Electrostatic Forces / 39
References / 49
v
vi CONTENTS
2 MICROWORLDMODELING:IMPACTOFLIQUIDAND
ROUGHNESS 55
PierreLambertandSte´phaneRe´gnier
2.1 Introduction / 55
2.2 Liquid Environments / 55
2.2.1 Classical Models / 55
2.2.2 Sphere–Sphere and Sphere–Plane Interactions / 60
2.2.3 Theoretical Comparison Between Air and Liquid / 68
2.2.4 Impact of Hydrodynamic Forces on Microobject
Behavior / 70
2.3 Microscopic Analysis / 74
2.3.1 AFM-Based Measurements / 74
2.3.2 Experiments on Adhesion Forces / 76
2.3.3 Various Phenomena / 83
2.4 Surface Roughness / 84
2.4.1 Surface Topography Measurements / 84
2.4.2 Statistical Parameters / 85
2.4.3 Models of Surface Roughness / 88
2.4.4 Fractal Parameters / 89
2.4.5 Extracting the Fractal Character of Surfaces / 93
2.4.6 Conclusion / 101
References / 102
II HANDLING STRATEGIES
3 UNIFIEDVIEWOFROBOTICMICROHANDLINGAND
SELF-ASSEMBLY 109
QuanZhouandVeikkoSariola
3.1 Background / 109
3.2 Robotic Microhandling / 111
3.2.1 Microhandling System / 111
3.2.2 Microhandling Strategies / 112
3.3 Self-Assembly / 115
3.3.1 Working Principle / 116
3.3.2 Self-Assembly Strategies / 117
3.4 Components of Microhandling / 119
3.4.1 Feeding / 119
3.4.2 Positioning / 120
3.4.3 Releasing, Alignment, and Fixing / 121
CONTENTS vii
3.4.4 Environment / 122
3.4.5 Surface Properties / 123
3.4.6 External Disturbance and Excitation / 125
3.4.7 Summary and Discussion / 126
3.5 Hybrid Microhandling / 127
3.5.1 Case Study: Hybrid Microhandling Combining Droplet
Self-Alignment and Robotic Microhandling / 128
3.5.2 Analysis of Droplet Self-Alignment-Based Hybrid
Microhandling / 136
3.5.3 Summary / 138
3.6 Conclusion / 138
References / 139
4 TOWARDAPRECISEMICROMANIPULATION 145
Me´lanieDafflonandReymondClavel
4.1 Introduction / 145
4.2 Handling Principles and Strategies Adapted to the
Microworld / 145
4.2.1 State of the Art of Micromanipulation Principles / 146
4.2.2 Adhesion Ratio at Interfaces / 146
4.2.3 Adhesion-Based Micromanipulation / 150
4.2.4 Grasping—A Special Case of Adhesion Handling / 159
4.2.5 Case of an Additional Force Acting at the Interface / 162
4.2.6 Caseof anExternalForceActing onthe Component / 163
4.3 Micromanipulation Setup / 164
4.4 Experimentations / 166
4.4.1 Microtweezer Family / 168
4.4.2 Inertial Microgripper Based on Adhesion / 173
4.4.3 Vacuum Nozzle Assisted by Vibration / 177
4.4.4 Thermodynamic Microgripper / 180
4.5 Conclusion / 184
References / 185
5 MICROHANDLINGSTRATEGIESANDMICROASSEMBLY
INSUBMERGEDMEDIUM 189
Michae¨lGauthier
5.1 Introduction / 189
5.2 Dielectrophoretic Gripper / 190
5.2.1 Principle of Dielectrophoresis / 190
viii CONTENTS
5.2.2 Application of the Dielectrophoresis in
Micromanipulation / 193
5.3 Submerged Freeze Gripper / 196
5.3.1 Ice Grippers in the Air / 196
5.4 Chemical Control of the Release in Submerged Handling / 202
5.4.1 Chemical Functionalization / 203
5.4.2 Experimental Force Measurements / 204
5.4.3 Modeling of Surface Charges / 210
5.4.4 Application of Functionalized Surfaces in
Micromanipulation / 211
5.5 Release on Adhesive Substrate and Microassembly / 212
5.5.1 Handling and Assembly Strategy / 212
5.5.2 Robotic Microassembly Device / 214
5.5.3 First Object Positioning / 216
5.5.4 Experimental Microassembly / 217
5.5.5 Insertion / 218
5.6 Conclusion / 221
References / 222
III ROBOTIC AND MICROASSEMBLY
6 ROBOTICMICROASSEMBLYOF3DMEMSSTRUCTURES 227
NikolaiDechev
6.1 Introduction / 227
6.2 Methodology of the Microassembly System / 228
6.2.1 Purpose of the Microassembly System / 228
6.2.2 System Objectives / 228
6.2.3 Microassembly versus Micromanipulation / 228
6.2.4 Microassembly Concept / 229
6.2.5 Interface Between Microassembly Subsystems / 229
6.3 Robotic Micromanipulator / 230
6.4 Overview of Microassembly System / 232
6.4.1 Bonding a Microgripper to the Probe Pin of the RM / 232
6.5 Modular Design Features for Compatibility with the
Microassembly System / 239
6.6 Grasping Interface (Interface Feature) / 239
6.7 PMKIL Microassembly Process / 241
6.7.1 Grasping a Micropart / 242
6.7.2 Removing the Micropart from Chip / 243