Substrate Noise Coupling in Analog RF Circuits (Artech House Microwave Library)

272 Pages·2010·5.76 MB·English

by  Stephane Bronckers

Sub strate Noise Coup ling
in An a log/RF Circuits
For a list ing of re cent ti tles in the Artech House Mic row ave Lib rary,
turn to the back of this book.
Sub strate Noise Coup ling
in An a log/RF Cir cuits
Stephane Bronckers
Geert Van der Plas
Gerd Vandersteen
Yves Rolain
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ISBN-13 978-1-59693-271-5
Cover de sign by Igor Valdman
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Contents
Foreword xiii
Preface xv
Acknowledgments xvii
Chapter1 Introduction 1
1.1 IntroductionandMotivation 1
1.2 Bookoverview 4
References 5
Chapter2 SubstrateNoisePropagation 7
2.1 Introduction 7
2.2 ModelingtheSubstrate 8
2.2.1 AnalyticalResistanceCalculationBetween
TwoContacts 9
2.2.2 FiniteDifferenceMethod 13
2.2.3 FiniteElementMethod 17
2.3 TheSubstrateModeledwithFDM 19
2.3.1 ExperimentalDescription 19
2.3.2 AnalysisoftheSubstrateNoisePropagation 20
2.3.3 Conclusions 27
2.4 TheSubstrateasaFiniteElementModel 28
2.4.1 SimulationMethodology 28
2.4.2 DealingwithN-DopedRegions 30
vii
viii SubstrateNoiseCouplinginAnalog/RFCircuits
2.4.3 SimulationSetupfortheTestStructure 33
2.4.4 Comparison 33
2.4.5 Conclusions 33
2.5 Conclusions 34
References 36
Chapter3 PassiveIsolationStructures 39
3.1 Introduction 39
3.2 OverviewandDescriptionoftheDifferentTypesofPassive
IsolationStructures 40
3.2.1 TheTemplateLayout 42
3.2.2 IntegratingtheDifferentTypesofGuardRings 43
3.2.3 SimulationSetup 44
3.3 PredictionandUnderstandingofGuardRings 44
3.3.1 ReferenceStructure 45
3.3.2 P-WellBlockIsolation 47
3.3.3 N-WellIsolation 50
3.3.4 P+ GuardRingShielding 52
3.3.5 TripleWellShielding 56
3.3.6 ComparisonandConclusion 60
3.4 DesignofanEffcientP+GuardRing 65
3.4.1 ImpedanceoftheGroundInterconnect 65
3.4.2 WidthoftheP+GuardRing 67
3.4.3 DistancetotheVictim 70
3.4.4 GuidelinesforGoodP+ GuardRingDesign 75
3.5 Conclusions 76
References 77
Chapter4 NoiseCouplinginActiveDevices 79
4.1 Introduction 79
4.2 SubstrateNoiseImpactonAnalogDesign 80
4.3 ImpactSimulationMethodology 82
4.3.1 EMSimulation 83
4.3.2 CircuitSimulation 86
4.4 TransistorTestBench 86
4.4.1 DescriptionoftheTransistorUnderTest 87
4.4.2 ModelingtheTransistorTestBench 87
4.4.3 ExperimentalValidation 92
4.5 SubstrateNoiseCouplingMechanismsinaTransistor 92
Contents ix
4.5.1 AnalyzingtheDifferentCouplingMechanisms
inaTransistor 94
4.5.2 DescriptionandMeasurementoftheDeviceUnder
Test 97
4.5.3 ModelingDifferentSubstrateNoiseCoupling
Mechanisms 100
4.5.4 QuantifyingtheDifferentSubstrateNoiseCoupling
Mechanisms 104
4.5.5 ExperimentalValidationoftheSubstrateNoise
CouplingMechanisms 106
4.6 Conclusions 108
References 109
Chapter5 MeasuringtheCouplingMechanismsinAnalog/RFCircuits 111
5.1 Introduction 111
5.2 Measurement-BasedIdentifcationoftheDominant
SubstrateNoiseCouplingMechanisms 114
5.2.1 MeasurementoftheDifferentSpurs 115
5.2.2 SensitivityFunctions 116
5.2.3 DeterminingtheInfuenceofthePCB 118
5.3 Example:900MHzLC-VCO 119
5.3.1 DescriptionoftheLC-VCO 119
5.3.2 SubstrateSensitivityMeasurements 120
5.3.3 RevealingtheDominantCouplingMechanism
forFMSpurs 123
5.3.4 RevealingtheDominantCouplingMechanism
forAMSpurs 128
5.3.5 InfuenceofthePCBDecouplingCapacitors
ontheSubstrateNoiseImpact 130
5.3.6 Conclusions 132
5.4 StudyoftheCouplingMechanismsBetweenaPower
AmpliferandanLC-VCO 133
5.4.1 DescriptionoftheDesignofthePPAand
theLC-VCO 135
5.4.2 CouplingMechanismsBetweenthePPAand
theLC-VCO 137
5.4.3 MeasuringtheDominantCouplingMechanisms 142
5.4.4 Conclusions 146