Microwave Component Mechanics (Artech House Microwave Library)

389 Pages·2003·3.49 MB·English

by  Harri Eskelinen

Microwave Component Mechanics
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Microwave Component Mechanics
Harri Eskelinen
Pekka Eskelinen
Artech House
Boston (cid:127) London
www.artechhouse.com
LibraryofCongressCataloging-in-PublicationData
Eskelinen,Harri.
Microwavecomponentmechanics/HarriEskelinen,PekkaEskelinen.
p. cm.—(ArtechHousemicrowavelibrary)
Includesbibliographicalreferencesandindex.
ISBN1-58053-368-X(alk.paper)
1.Microwavedevices—Designandconstruction. I.Eskelinen,Pekka. II.Title.
III.Series.
TK7876.E85 2003
621.381’33—dc21 2002043667
BritishLibraryCataloguinginPublicationData
Eskelinen,Harri
Microwavecomponentcechanics.—(ArtechHousemicrowavelibrary)
1.Microwavedevices—Designandconstruction
I.Title II.Eskelinen,Pekka
621.3’8133
ISBN1-58053-368-X
CoverdesignbyIgorValdman
©2003ARTECHHOUSE,INC.
685CantonStreet
Norwood,MA02062
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Alltermsmentionedinthisbookthatareknowntobetrademarksorservicemarkshave
been appropriately capitalized. Artech House cannot attest to the accuracy of this informa-
tion.Useofaterminthisbookshouldnotberegardedasaffectingthevalidityofanytrade-
markorservicemark.
InternationalStandardBookNumber:1-58053-368-X
LibraryofCongressCatalogCardNumber:2002043667
10987654321
Contents
Acknowledgments xv
Introduction xvii
Part1:DesignforManufacturabilityandAssembly
ofMechanicalMicrowaveComponents 1
1 SpecialRequirementsforMicrowaveMechanics 3
1.1 FundamentalsofMicrowaves 4
1.1.1 Maxwell’sEquations 4
1.1.2 GeneralWavePropagation 5
1.2 DimensionalUncertainties 8
1.3 MaterialProblems 15
1.3.1 AGoodConductor 17
1.3.2 ElectromagneticRadiation 19
1.3.3 ElectromagneticWavesInitiatedbyCavities 22
1.4 ConnectionPhilosophies 26
v
vi MicrowaveComponentMechanics
1.5 TypicalUserandApplicationProfiles 27
References 27
2 SystematicFlowchartModel 29
2.1 PrinciplesofSystematicDesign 29
2.1.1 SomeAssistingTools 31
2.1.2 ListofRequirements 33
2.2 AdvancedMethodologyforDesigning
MicrowaveMechanics 34
2.2.1 BasicElementsoftheAdvancedMethodology 35
2.2.2 FlowchartPresentationoftheTunedMethodology 39
References 42
3 MaterialSelectionforMicrowaveMechanics 45
3.1 BasicGuidelinesforMicrowaveDesigners 45
3.2 EffectsoftheProduct’sOperatingFrequency 47
3.2.1 ElectromagneticLosses 47
3.2.2 DefinitionofthePenetrationDepth 48
3.3 EffectsoftheOperatingEnvironment 51
3.4 MetallicComponents 54
3.4.1 Oxygen-FreeCopper 55
3.4.2 SuperconductorOxygen-FreeCopper 55
3.4.3 BerylliumCopperAlloy 56
3.4.4 PhosphorusBronze 57
3.4.5 Brass 58
3.4.6 StainlessSteels 58
3.4.7 AluminumAlloys 60
3.4.8 Invar 62
3.5 UseofPlastics 64
3.5.1 PTFE 64
3.5.2 PE 64
3.5.3 OtherFluorinePlastics 65
3.5.4 PEEK 65
Contents vii
3.5.5 PolyphenyleneOxide 66
3.5.6 ReinforcedPlastics 66
3.6 UtilizationofCeramicMaterialsandPowder
Metallurgy 66
3.6.1 Powder-MetallurgicallyManufacturedMaterials
forMicrowaveMechanics 69
3.6.2 ApplicationAreasofCeramicMaterialsin
MicrowaveMechanics 73
3.6.3 LowTemperatureCofiredCeramics 74
References 77
4 Computer-AidedEnvironmentforDesignWork 79
4.1 IntegrationofBasicCADTools 80
4.1.1 InteractionBetweenVirtualEngineeringand
HypermediaApplicationsinControllingHeat
InputDuringWeldingofMicrowaveComponents 86
4.1.2 IntegrationofComputer-AssistedEngineeringand
MicrowaveMechanicsSimulationinWelded
StriplineFilterDesign 94
4.2 TypicalSimulationSoftwareSolutionsfor
Microwaves 96
4.3 IntegrationProblemsofCurrentCADApplications 102
4.3.1 ProblemsinCADApplicationsMadeforGeneral
MechanicalEngineering 102
4.3.2 ProblemsinCADApplicationsDevelopedfor
MicrowaveDesign 103
References 108
5 InstructionsforTechnicalDocumentation
andDimensioning 111
5.1 TheRelationshipBetweenRFParameters
andMechanicalParameters 112
5.2 DifferencesBetweenDFMA-and
Performance-OrientedApproaches 114
viii MicrowaveComponentMechanics
5.3 OntheSuitabilityofGeneralManufacturing
TolerancesforMWMechanics 116
References 118
6 EffectsofProductionVolumeandRelatedTopics 119
6.1 GeneralAspectsRelatedtotheEvaluation
ofProductionCosts 119
6.1.1 DesignCosts 119
6.1.2 MaterialCosts 120
6.1.3 ManufacturingCosts 120
6.1.4 CostsRelatedtotheExpectedLifetime
oftheProduct 120
6.2 RelationshipBetweenManufacturingCosts
andSurfaceFinish 121
6.3 RelationshipBetweenManufacturingCosts
andDimensionalTolerance 122
6.4 DesignforManufacturability 122
6.4.1 GoalsofDFM/DFMA 123
6.4.2 TheBarrierBetweenDesigningandManufacturing 123
6.4.3 PuttingDFMinPractice 125
6.4.4 AdditionalToolsforDFM 127
6.4.5 MoreEffectiveUseofDFM 128
6.5 ACross-TechnologicalApproach 129
6.6 ConcurrentEngineeringDesign 131
6.6.1 TheDesignProcessforCE 132
6.6.2 ManufacturabilityforCEDesign 133
6.7 ManufacturingCostsofPrototypes 134
6.8 QualityAspects 135
6.9 CostEvaluationbyUtilizingParametric
ComponentDesign 135
6.10 CostAccumulationinLaserProcessedComponents 136
6.11 ManufacturingCostsofOtherManufacturing
Processes 141
Contents ix
6.12 AMultilevelOptimizingApproachfor
Cost-EffectiveProduction 141
References 148
Part2:ManufacturingTechnologiesforSome
PassiveMicrowaveComponents 151
7 WeldedComponents 153
7.1 WeldingProcessesfortheTopicArea 153
7.2 LaserWeldinginGeneral 154
7.2.1 ParametersofLaserWelding 156
7.3 Laser-WeldedStriplineFilter 157
7.4 UtilizingUltrasonicWeldinginFilter
Constructions 164
7.5 WeldedJointGeometriesofMicrowave
CavityResonatorsandWaveguides 170
7.5.1 PracticalWeldingInstructionsforCavity
ResonatorsandWaveguides 174
7.6 WeldedRadiatingElementsofPatchAntennas 177
7.7 AComparisonofWeldingProcessesfor
EncapsulatingElectronics 192
7.7.1 AdvantagesofLaserWeldedSealing 193
7.7.2 ProjectionWeldingApplication 197
References 200
8 OtherJoiningTechnologies 203
8.1 AssemblyRulesforScrewJointstoObtain
ReliabilityandRequiredMicrowavePerformance 203
8.2 GluedJoints 205
8.2.1 Acrylic-BasedAdhesives 205
8.2.2 Cyanoacrylate-BasedAdhesives 206
8.2.3 UV-CuredAdhesives 206
8.2.4 AdhesiveswithGoodElectricalConductivity 206