Table Of ContentMEMS
Accelerometers
Edited by
Mahmoud Rasras, Ibrahim (Abe) M. Elfadel and Ha Duong Ngo
Printed Edition of the Special Issue Published in Micromachines
www.mdpi.com/journal/micromachines
MEMS Accelerometers
MEMS Accelerometers
SpecialIssueEditors
MahmoudRasras
Ibrahim(Abe)M.Elfadel
HaDuongNgo
MDPI•Basel•Beijing•Wuhan•Barcelona•Belgrade
Special Issue Editors
Mahmoud Rasras Ibrahim (Abe) M. Elfadel
New York University Abu Dhabi Khalifa University
UAE Abu Dhabi, UAE
Ha Duong Ngo
University of Applied Sciences Berlin
FraunhoferInstituteforReliabilityandMicrointegrationIZM
Germany
EditorialOffice
MDPI
St.Alban-Anlage66
4052Basel,Switzerland
This is a reprint of articles from the Special Issue published online in the open access journal
Micromachines(ISSN2072-666X)from2018to2019(availableat: https://www.mdpi.com/journal/
micromachines/specialissues/MEMSAccelerometers)
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Contents
AbouttheSpecialIssueEditors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . vii
MahmoudRasras,Ibrahim(Abe)M.ElfadelandHaDuongNgo
EditorialfortheSpecialIssueonMEMSAccelerometers
Reprintedfrom:Micromachines2019,10,290,doi:10.3390/mi10050290 . . . . . . . . . . . . . . . . 1
XiaofengZhao,YingWangandDianzhongWen
Fabrication and Characteristics of a SOI Three-Axis Acceleration Sensor Based on
MEMSTechnology
Reprintedfrom:Micromachines2019,10,238,doi:10.3390/mi10040238 . . . . . . . . . . . . . . . . 4
ZhaohuaYang,DanLiandYuzheSun
Analysis of Kerr Noise in Angular-Rate Sensing Based on Mode Splitting in a
Whispering-Gallery-ModeMicroresonator
Reprintedfrom:Micromachines2019,10,150,doi:10.3390/mi10020150 . . . . . . . . . . . . . . . . 17
ChengYuan,JizhouLai,PinLyu,PengShi,WeiZhaoandKaiHuang
ANovelFault-TolerantNavigationandPositioningMethodwithStereo-Camera/MicroElectro
MechanicalSystemsInertialMeasurementUnit(MEMS-IMU)inHostileEnvironment
Reprintedfrom:Micromachines2018,9,626,doi:10.3390/mi9120626 . . . . . . . . . . . . . . . . . 25
ZakriyaMohammed,Ibrahim(Abe)M.ElfadelandMahmoudRasras
MonolithicMultiDegreeofFreedom(MDoF)CapacitiveMEMSAccelerometers
Reprintedfrom:Micromachines2018,9,602,doi:10.3390/mi9110602 . . . . . . . . . . . . . . . . . 44
FufuWang,LuZhang,LongLi,ZhihongQiaoandQianCao
DesignandAnalysisoftheElastic-BeamDelayingMechanisminaMicro-Electro-Mechanical
SystemsDevice
Reprintedfrom:Micromachines2018,9,567,doi:10.3390/mi9110567 . . . . . . . . . . . . . . . . . 64
HaitaoLiu,KaiWei,ZhengzhouLi,WengangHuang,YiXuandWeiCui
A Novel, Hybrid-Integrated, High-Precision, Vacuum Microelectronic Accelerometer with
Nano-FieldEmissionTips
Reprintedfrom:Micromachines2018,9,481,doi:10.3390/mi9100481 . . . . . . . . . . . . . . . . . 77
WeiYang,ChundiXiu,JiaruiYe,ZhixingLin,HaisongWei,DayuYanandDongkaiYang
LSS-RM:UsingMulti-MountedDevicestoConstructaLightweightSite-SurveyRadioMapfor
WiFiPositioning
Reprintedfrom:Micromachines2018,9,458,doi:10.3390/mi9090458 . . . . . . . . . . . . . . . . . 89
Wen-YenLin,VijayKumarVerma,Ming-YihLeeandChao-SungLai
ActivityMonitoringwithaWrist-Worn,Accelerometer-BasedDevice
Reprintedfrom:Micromachines2018,9,450,doi:10.3390/mi9090450 . . . . . . . . . . . . . . . . . 113
DongliangChen,XiaoweiLiu,LiangYin,YinhangWang,ZhaoheShiandGuoruiZhang
AΣΔClosed-LoopInterfaceforaMEMSAccelerometerwithDigitalBuilt-InSelf-TestFunction
Reprintedfrom:Micromachines2018,9,444,doi:10.3390/mi9090444 . . . . . . . . . . . . . . . . . 125
SenQiu,LongLiu,HongyuZhao,ZhelongWangandYongmeiJiang
MEMS Inertial Sensors Based Gait Analysis for Rehabilitation Assessment via Multi-Sensor
Fusion
Reprintedfrom:Micromachines2018,9,442,doi:10.3390/mi9090442 . . . . . . . . . . . . . . . . . 148
v
Jae-NeungLee,Yeong-HyeonByeonandKeun-ChangKwak
DesignofEnsembleStackedAuto-EncoderforClassificationofHorseGaitswithMEMSInertial
SensorTechnology
Reprintedfrom:Micromachines2018,9,411,doi:10.3390/mi9080411 . . . . . . . . . . . . . . . . . 165
JaeKeonKim,MaeumHan,Shin-WonKang,SeongHoKongandDaewoongJung
Multi-axisResponseofaThermalConvection-basedAccelerometer
Reprintedfrom:Micromachines2018,9,329,doi:10.3390/mi9070329 . . . . . . . . . . . . . . . . . 182
BianTian,HuafengLi,HuaYang,YulongZhao,PeiChenandDaleiSong
Design and Performance Test of an Ocean Turbulent Kinetic Energy Dissipation Rate
MeasurementProbe
Reprintedfrom:Micromachines2018,9,311,doi:10.3390/mi9060311 . . . . . . . . . . . . . . . . . 195
Xiaodong Hu, Piotr Mackowiak, Manuel Ba¨uscher, Oswin Ehrmann, Klaus-Dieter Lang,
MartinSchneider-Ramelow,StefanLinkeandHa-DuongNgo
Design and Application of a High-G Piezoresistive Acceleration Sensor for
High-ImpactApplication
Reprintedfrom:Micromachines2018,9,266,doi:10.3390/mi9060266 . . . . . . . . . . . . . . . . . 211
XianshanDong,ShaohuaYang,JunhuaZhu,YunfeiEnandQinwenHuang
MethodofMeasuringtheMismatchofParasiticCapacitanceinMEMSAccelerometerBasedon
RegulatingElectrostaticStiffness
Reprintedfrom:Micromachines2018,9,128,doi:10.3390/mi9030128 . . . . . . . . . . . . . . . . . 219
Huan Liu, Runiu Fang, Min Miao, Yichuan Zhang, Yingzhan Yan, Xiaoping Tang,
Huixiang Lu and Yufeng Jin
Design, Fabrication, and Performance Characterization of LTCC-Based
Capacitive Accelerometers
Reprintedfrom:Micromachines2018,9,120,doi:10.3390/mi9030120 . . . . . . . . . . . . . . . . . 227
vi
About the Special Issue Editors
MahmoudRasrasisanAssociateProfessoroftheElectricalandComputerEngineeringatNewYork
UniversityAbuDhabi(NYUAD).HereceivedaPhDdegreeinphysicsfromtheCatholicUniversity
ofLeuven,Belgium.Dr.Rasrashasmorethan11yearsofindustrialresearchexperienceasaMember
ofTechnicalStaffatBellLabs,Alcatel-Lucent,NJ,USA.PriortojoiningNYUAD.Dr. Rasraswasa
facultymemberandformerDirectoroftheSRC/GFCenter-for-ExcellenceforIntegratedPhotonics
atMasdarInstitute(partofKhalifaUniversity).Heauthoredandco-authoredmorethan120journal
andconferencepapersandholds33USpatents.Dr.RasrasisanAssociateEditorofOpticsExpress,
GuestEditor–MDPI,andaSeniorIEEEMember.
Ibrahim (Abe) M. Elfadel has been a professor of electrical and computer engineering at Khalifa
University,AbuDhabi,UAE,since2011. FromMay2014toApril2018,heservedastheprogram
managerofMubadala’sTwinLabMEMS,ajointcollaborationwiththeInstituteofMicroelectronics
and GLOBALFOUNDRIES, Singapore, on next-generation MEMS platforms. Prior to his current
position,Dr.Elfadelhada15-yearcareerwiththecorporateCADorganizationsatIBM,Yorktown
Heights, NY. His current MEMS research interests include IMU, piezoelectric energy harvesting,
piezoresistiveforcesensing,andCADmethodologiesforMEMS-CMOSco-design.Dr.Elfadelisthe
inventorof55USpatents,theauthorofmorethan140archivalarticles,andtheeditorof3books.
HeistherecipientofsixInventionAchievementAwards,oneOutstandingTechnicalAchievement
Award, and one Research Division Award, all from IBM. In 2014, he was the recipient of the
DonaldO.PedersonBestPaperAwardfromtheIEEETransactionsonCAD.In2018,hereceivedthe
BoardofDirectorsRecognitionAwardfromtheUS-basedSemiconductorResearchCorporationfor
”PioneeringSemiconductorResearchinAbuDhabi”.Dr.Elfadelhasservedonthetechnicalprogram
committees of several major conferences, including the Symposium on Design, Test, Integration,
and Packaging of MEMS/MOEMS (DTIP). He is an associate editor of the IEEE Transactions on
VLSIandwasageneralco-chairoftheIFIP/IEEE25thInternationalConferenceonVeryLargeScale
Integration(VLSI-SoC2017).Dr.ElfadelreceivedhisPhDfromMITin1993.
HaDuongNgostudiedelectricalengineeringinUdSSR,inUkraineandmicrosystemtechnologiesin
Chemnitz,Germany.HereceivedaGermandiplomain1998fromTechnicalUniversityChemnitz.He
joinedMAT(MicrosensorsandActuatorsTechnologyCenter)in1998andworkedonMEMSsensors
andactuators. From2004to2006heworkedwithSchottAG,wherehisresearchanddevelopment
workfocusedonCMOSimagesensorsandwafer-levelpackagingtechnologies. HereceivedaPhD
onMOEMSfromTechnicalUniversityBerlinin2006. Bytheendof2006, hejoinedtheElectrical
FacultyandtheResearchCenterforMicroperiphericTechnologies.HewasheadoftheMicrosensors
andActuatorTechnologyCenteratTechnicalUniversity. HeisnowaprofessorattheUniversityof
AppliedSciencesBerlinandagroupleaderofmicrosensorstechnologyandhigh-densityintegration
atFraunhoferInstituteIZM.Hispresentresearchinterestsincludesilicon, SOIandsiliconcarbide
technology,microsensorsandactuators,AeroMEMS,printedMEMS,andsensorspackaging.
vii
micromachines
Editorial
Editorial for the Special Issue on
MEMS Accelerometers
MahmoudRasras1,*,Ibrahim(Abe)M.Elfadel2,*andHaDuongNgo3,4,*
1 ElectricalandComputerEngineering,EngineeringDivision,NewYorkUniversityAbuDhabi,
AbuDhabi,UAE
2 DepartmentofElectricalandComputerEngineering,KhalifaUniversity,AbuDhabi,UAE
3 HochschulefürTechnikundWirtschaftBerlin,UniversityofAppliedSciences,Treskowallee8,
10318Berlin,Germany
4 FraunhoferInstituteforReliabilityandMicrointegrationIZM,DepartmentWaferLevelIntegration,
GroupLeaderMicrosensorsTechnology,Gustav-Meyer-Allee25,13355Berlin,Germany
* Correspondence:[email protected](M.R.);[email protected](I.M.E.);
[email protected](H.D.N.)
Received:26April2019;Accepted:26April2019;Published:29April2019
Micro-Electro-MechanicalSystems(MEMS)devicesarewidelyusedformotion,pressure,light,
andultrasoundsensingapplications. Theyarealsousedasmicroswitchesandmicroactuatorsin
controlapplications.ResearchonintegratedMEMStechnologyhasundergoneextensivedevelopment
drivenbytherequirementsofcompactfootprint,lowcost,andincreasedfunctionality.Accelerometers
areamongthemostwidelyusedsensorsimplementedinMEMStechnology.MEMSAccelerometers
are showing a growing presence in almost all industries, ranging from consumer electronics to
transportation and from games and entertainment to healthcare. Their MEMS embodiment has
evolvedfromsingle,stand-alonedevicestotheintegrated,6-axisand9-axisinertialmotionunits
thatareavailableonthemarkettoday. AtraditionalMEMSaccelerometeremploysaproofmass
suspendedtosprings,whichdisplacesinresponsetoanexternalacceleration.Asingleproofmass
canbeusedforone-ormulti-axissensing.Avarietyoftransductionmechanismshavebeenusedto
detectthedisplacement.Theyinclude—capacitive,piezoelectric,piezoresistive,thermal,tunneling,
andoptical. CapacitiveaccelerometersarewidelyusedduetotheirDCmeasurementinterface,
thermal stability, reliability, and low-cost. However, they are sensitive to electromagnetic field
interferencesandhavepoorperformanceforhigh-endapplications(e.g., preciseattitudecontrol
forsatellites). Overthepastthreedecades,steadyprogresshasbeenmadeintheareaofoptical
accelerometersforhigh-performanceandhigh-sensitivityapplicationsbutseveralchallengesarestill
tobetackledbyresearchersandengineerstofullyrealizeOpto-MechanicalAccelerometers,suchas
chip-scaleintegration,scaling,lowbandwidth,etc. Currently,opticaltechnologiesarestillusedin
navigationsystemsandtacticalguidance.Newapplicationshavebeenenabledbylow-costMEMS
sensors,andsignificantprogresshasbeenmadeinthepastfewyearsintermsoftheirreliability.
MEMSaccelerometersarenowacceptedinhigh-reliabilityenvironments,andareevenstartingto
replaceopticalandotherestablishedtechnologies.
ThisSpecialIssueon“MEMSAccelerometers”includesresearchpapers,shortcommunications,
andreviewarticles. Thereare16paperspublishedcoveringthedesign,fabrication,modelingand
applicationsofMEMSaccelerometers. Halfofthepapersdiscussaccelerometerintegration[1,2],
piezoresistive sensing [3,4] multi-axis accelerometers, and review current technologies [4–6].
Three papers investigate MEMS accelerometer multi-physics modeling [7–10]. The rest of the
papersarefocusedontheapplicationdomains,includingenvironmentalmonitoring[11]andWiFi
positioning[12]. Healthcaremonitoring,positioninganddailyactivitymonitoringarediscussed
in[13,14],whilewearablebodysensorsforpatientswithgaitimpairmentsandtheclassificationof
horsegaitsforself-coachingarecoveredin[15,16].
Micromachines2019,10,290;doi:10.3390/mi10050290 1 www.mdpi.com/journal/micromachines
