Introduction to microelectromechanical systems engineering

305 Pages·2004·4.283 MB·English

by  Nadim Maluf, Kirt Williams

An Introduction to
Microelectromechanical
Systems Engineering
Second Edition
ForalistingofrecenttitlesintheArtechHouseMicroelectromechanical
Systems(MEMS)Series,turntothebackofthisbook.
An Introduction to
Microelectromechanical
Systems Engineering
Second Edition
Nadim Maluf
Kirt Williams
Artech House, Inc.
Boston • London
www.artechhouse.com
LibraryofCongressCataloging-in-PublicationData
AcatalogrecordforthisbookisavailablefromtheU.S.LibraryofCongress.
BritishLibraryCataloguinginPublicationData
Maluf,Nadim.
An Introduction to microelectromechanical systems engineering–2nd ed. –(Artech House
microelectromechanicallibrary)
1.Microelectromechanicalsystems
I.Title II.Williams,Kirt
621.3’81
ISBN1-58053-590-9
CoverdesignbyIgorValdman
©2004ARTECHHOUSE,INC.
685CantonStreet
Norwood,MA02062
Allrightsreserved.PrintedandboundintheUnitedStatesofAmerica.Nopartofthisbook
maybereproducedorutilizedinanyformorbyanymeans,electronicormechanical,includ-
ing photocopying, recording, or by any information storage and retrieval system, without
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Alltermsmentionedinthisbookthatareknowntobetrademarksorservicemarkshave
beenappropriatelycapitalized.ArtechHousecannotattesttotheaccuracyofthisinforma-
tion.Useofaterminthisbookshouldnotberegardedasaffectingthevalidityofanytrade-
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InternationalStandardBookNumber:1-58053-590-9
10987654321
Toourfamilies
Tanya,Ella,andJad
Erika,Gordon,Brynn,andReed
.
Contents
Foreword xiii
Preface xv
Preface to First Edition xix
CHAPTER 1
MEMS: A Technology from Lilliput 1
ThePromiseofTechnology 1
WhatAreMEMS—orMST? 2
WhatIsMicromachining? 3
ApplicationsandMarkets 4
ToMEMSorNotToMEMS? 7
Standards 8
ThePsychologicalBarrier 8
Journals,Conferences,andWebSites 9
ListofJournalsandMagazines 9
ListofConferencesandMeetings 10
Summary 11
References 11
SelectedBibliography 12
CHAPTER 2
Materials for MEMS 13
Silicon-CompatibleMaterialSystem 13
Silicon 13
SiliconOxideandNitride 19
ThinMetalFilms 20
Polymers 21
OtherMaterialsandSubstrates 21
GlassandFusedQuartzSubstrates 21
SiliconCarbideandDiamond 22
GalliumArsenideandOtherGroupIII-VCompoundSemiconductors 22
Polymers 23
Shape-MemoryAlloys 23
ImportantMaterialPropertiesandPhysicalEffects 24
vii
viii Contents
Piezoresistivity 24
Piezoelectricity 26
Thermoelectricity 29
Summary 31
References 31
SelectedBibliography 32
CHAPTER 3
Processes for Micromachining 33
BasicProcessTools 34
Epitaxy 34
Oxidation 35
SputterDeposition 35
Evaporation 36
Chemical-VaporDeposition 37
Spin-OnMethods 40
Lithography 40
Etching 44
AdvancedProcessTools 55
AnodicBonding 55
SiliconDirectBonding 56
Grinding,Polishing,andChemical-MechanicalPolishing 57
Sol-GelDepositionMethods 58
ElectroplatingandMolding 58
SupercriticalDrying 60
Self-AssembledMonolayers 61
SU-8PhotosensitiveEpoxy 61
PhotosensitiveGlass 62
EFAB 62
NonlithographicMicrofabricationTechnologies 63
UltraprecisionMechanicalMachining 64
LaserMachining 64
ElectrodischargeMachining 65
ScreenPrinting 65
MicrocontactPrinting/SoftLithography 66
NanoimprintLithography 67
HotEmbossing 67
UltrasonicMachining 68
CombiningtheTools—ExamplesofCommercialProcesses 68
PolysiliconSurfaceMicromachining 69
CombiningSiliconFusionBondingwithReactiveIonEtching 71
DRIEofSOIWafers 71
SingleCrystalReactiveEtchingandMetallization 72
Summary 74
References 75
SelectedBibliography 77