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Contents
Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ix
Acknowledgments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi
Editors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xiii
AdvisoryBoard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xv
Contributors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xix
IntroductiontoMicrowavesandRF
PatrickFay. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I-1
1
OverviewofMicrowaveEngineering
MikeGolio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
SECTION I Passive Technologies
2
PassiveLumpedComponents
AlfyRiddle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
3
PassiveMicrowaveDevices
MichaelB.Steer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
4
DielectricResonators
S.JerryFiedziuszko. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
5
RFMEMS
KarlVarian . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
v
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vi Contents
6
SurfaceAcousticWave(SAW)Filters
DonaldC.Malocha . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
7
RFCoaxialCables
MichaelE.Majerus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1
8
CoaxialConnectors
DavidAnderson . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1
9
AntennaTechnology
JamesB.West . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-1
10
PhasedArrayAntennaTechnology
JamesB.West . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-1
11
TheFresnel-ZonePlateAntenna
JamesC.Wiltse. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-1
12
RFPackageDesignandDevelopment
JeanneS.Pavio. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-1
SECTION II Active Device Technologies
13
Varactors
JanStake . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-1
14
SchottkyDiodeFrequencyMultipliers
JackEastandImranMehdi . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14-1
15
TransitTimeMicrowaveDevices
RobertJ.Trew. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-1
16
BipolarJunctionTransistors(BJTs)
JohnC.Cowles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16-1
17
HeterostructureBipolarTransistors(HBTs)
WilliamLiu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17-1
18
Metal-Oxide-SemiconductorField-EffectTransistors(MOSFETs)
JulioCosta,MikeCarroll,G.AliRezvani,andTomMcKay . . . . . . . . . . . . . . . . . . . 18-1
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RFCMOSModelingandCircuitApplications
JulioCosta,MikeCarroll,G.AliRezvani,andTomMcKay . . . . . . . . . . . . . . . . . . . 19-1
20
MetalSemiconductorFieldEffectTransistors
MichaelS.Shur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20-1
21
HighElectronMobilityTransistors(HEMTs)
PrashantChavarkarandUmeshMishra . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21-1
22
NitrideDevices
RobertJ.Trew. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22-1
23
MicrowaveVacuumTubes
JerryC.Whitaker,RobertR.Weirather,andThomasK.Ishii. . . . . . . . . . . . . . . . . . 23-1
24
MonolithicMicrowaveICTechnology
LawrenceP.Dunleavy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24-1
25
BringingRFICstotheMarket
JohnC.Cowles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25-1
SECTION III Materials Properties
26
Metals
MikeGolio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26-1
27
Dielectrics
K.F.Etzold. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27-1
28
FerroelectricsandPiezoelectrics
K.F.Etzold. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28-1
29
MaterialPropertiesofSemiconductors
H.MikeHarris. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29-1
AppendixA:Mathematics,Symbols,andPhysicalConstants . . . . . . . . . . . . A-1
AppendixB:MicrowaveEngineeringAppendix
JohnP.Wendler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-1
Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I-1
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Preface
The first edition of the RF and Microwave Handbook was published in 2000. The project got off to an
inauspiciousstartwhen24inchesofsnowfellinDenvertheeveningbeforetheadvisoryboardplannedto
holdtheirkick-offmeeting.TwomembersoftheboardweretrappedfordaysintheDenverairportsince
planeswerenotarrivingorleaving.Becauseofroadclosures,onememberwasstrandedonlymilesaway
fromthemeetinginBoulder.AndtheremainderoftheboardwasstrandedinaDenverhotel10miles
fromtheairport.Despitethisominousbeginning,aplanwasformed,expertauthorsrecruited,andthe
bookwasdevelopedandpublished.Theplanninganddevelopmentofthissecondeditionhavebeenvery
smoothanduneventfulincomparisontoourfirstefforts.Sincepublicationin2000,thevalueoftheRF
andMicrowaveHandbookhasbeenrecognizedbythousandsofengineersthroughouttheworld. Three
derivativehandbookshavealsobeenpublishedandembracedbythemicrowaveindustry.Theadvisory
boardbelievesthatthiseditionwillbefoundtobeofevengreatervaluethanthefirstedition.
Priortothe1990s,microwaveengineeringwasemployedalmostexclusivelytoaddressmilitary,satellite,
andavionicsapplications.In1985,therewereafewlimitedapplicationsofRFandmicrowavesystemsthat
laymenmightbefamiliarwithsuchassatelliteTVandtheuseofsatellitecommunicationsforoverseas
phonecalls.Pagerswerealsoavailablebutnotcommon.Incontrast,by1990thewirelessrevolutionhad
begun.Cellphoneswerebecomingcommonandnewapplicationsofwirelesstechnologywereemerging
everyday.Companiesinvolvedinwirelessmarketsseemedtohavealicensetoprintmoney.Atthetime
oftheintroductionofthefirsteditionoftheRFandMicrowaveHandbook,wirelesselectronicproducts
werepervasive,butrelativelysimple,earlygenerationsoftheadvancedwirelessproductsavailabletoday.
Atpresent,thenumberofpeopleusingwirelessvoiceanddatasystemscontinuestogrow.Newsystems
suchas3Gphones, 4Gphones, andWiMAXrepresentemergingnewwirelessmarketswithsignificant
growth potential. All of these wireless products are dependent on the RF and microwave component
andsystemengineering, whichisthesubjectofthisbook. Duringthistimethemilitary, satellite, and
avionicssystemshavealsobecomeincreasinglycomplex.Theresearchanddevelopmentthatdrivesthese
applicationscontinuestoserveasthefoundationformostofthecommercialwirelessproductsavailable
toconsumers.
ThiseditionofthehandbookcoversissuesofinteresttoengineersinvolvedinRF/microwavesystem
andcomponentdevelopment.Thesecondeditionincludessignificantlyexpandedtopiccoverageaswell
asupdatedornewarticlesformostofthetopicsincludedinthefirstedition.Theexpansionofmaterial
haspromptedthedivisionofthehandbookintothreeindependentvolumesofmaterial.Thechaptersare
aimedatworkingengineers,managers,andacademicswhohaveaneedtounderstandmicrowavetopics
outsidetheirareaofexpertise.Althoughthebookisnotwrittenasatextbook,researchersandstudents
will find it useful. Most of the chapters provide extensive references so that they will not only explain
fundamentalsofeachfield,butalsoserveasastartingpointforfurtherin-depthresearch.
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Description:In the high frequency world, the passive technologies required to realize RF and microwave functionality present distinctive challenges. SAW filters, dielectric resonators, MEMS, and waveguide do not have counterparts in the low frequency or digital environment. Even when conventional lumped compone
