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Download Microvias: For Low Cost, High Density Interconnects by John H. Lau, S.W. Ricky Lee in PDF format completely FREE. No registration required, no payment needed. Get instant access to this valuable resource on PDFdrive.to!
About Microvias: For Low Cost, High Density Interconnects
The first comprehensive and in-depth guide to microvia and wafer level chip scale package (WLCSP) technologies. This reference gives you cutting edge information on the most important developments and latest research results in applying the microvia and WLCSP technologies to low-cost and high-density interconnects. For professionals active in microvia and WLCSP research and development, those who wish to master microvia and WLCSP problem solving methods, and those demanding a cost-effective design and high-yield manufacturing process for their low-cost and high-density interconnect systems, here is up-to-the-minute coverage of all aspects of this fascinating field.
Detailed Information
| Author: | John H. Lau, S.W. Ricky Lee |
|---|---|
| Publication Year: | 2001 |
| ISBN: | 71363270 |
| Pages: | 549 |
| Language: | English |
| File Size: | 11.5 |
| Format: | |
| Price: | FREE |
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