Alcatel 1626 LM

100 Pages·2006·0.99 MB·English

Technical Handbook
Alcatel
1626 LM
Multi Reach DWDM Platform
1626 LM REL.3.0
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TABLE OF CONTENTS
LIST OF FIGURES AND TABLES 6
HANDBOOK GUIDE 11
1 HANDBOOK STRUCTURE AND CONFIGURATION CHECK 13
1.1 General information 13
1.2 Handbook applicability 13
1.3 Product–release handbooks 14
1.4 Handbook Structure 17
1.5 Handbook configuration check 18
1.5.1 List of the editions and modified parts 18
1.5.2 Notes on Ed.01a 18
2 SAFETY NORMS AND LABELS 19
2.1 First aid for electric shock 19
2.2 Safety Rules 22
2.2.1 General Rules 22
2.2.2 Labels Indicating Danger, Forbiddance, Command 22
2.2.3 Dangerous Electrical Voltages 24
2.2.4 Harmful Optical Signals 25
2.2.5 Risks of Explosions 27
2.2.6 Moving Mechanical Parts 27
2.2.7 Heat-radiating Mechanical Parts 28
2.2.8 Specific safety rules in this handbook 29
3 OTHER NORMS AND LABELS 30
3.1 Electromagnetic Compatibility 30
3.1.1 General Norms - Installation 30
3.1.2 General Norms - Turn-on, Tests & Operation 31
3.1.3 General Norms - Maintenance 31
3.2 Electrostatic Dischargers (ESD) 32
3.3 Suggestions, notes and cautions 33
3.4 Labels affixed to the Equipment 33
4 LIST OF ABBREVIATIONS 47
5 GENERAL ON ALCATEL CUSTOMER DOCUMENTATION 52
5.1 Products, product–releases, versions and Customer Documentation 52
5.2 Handbook supplied to Customers 53
5.3 Aims of standard Customer Documentation 53
5.4 Handbook Updating 54
5.4.1 Changes introduced in the same product–release (same handbook P/N) 54

P.OTTOLENGHI C.GIANNI
01A 060322
R.BRASSAC, P.Y.PETTON
ED DATE CHANGE NOTE APPRAISAL AUTHORITY ORIGINATOR
1626 LM REL.3.0 TECHNICAL HANDBOOK
1626LM Rel.3.0
Technical Handbook
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5.4.2 Changes due to a new product–release 54
5.5 Customer documentation supplied on CD-ROM 55
5.5.1 Contents, creation and production of a CD-ROM 55
5.5.2 Use of the CD-ROM 56
5.5.3 CD-ROM identification 56
5.5.4 CD-ROM updating 56
DESCRIPTIONS 58
1 GENERAL 60
1.1 Introduction to the equipment 60
1.2 Equipment basic configurations 67
1.2.1 50 GHz grid supported configurations 69
1.2.2 100 GHz grid supported configurations 75
1.2.3 50 and 100 GHz grid supported configurations 77
1.3 Upgrade configurations 79
1.3.1 Upgrading from OADM to R-OADM 79
1.3.2 Upgrading legacy equipment 84
1.4 Network architectures 90
1.4.1 Point to point links 90
1.4.2 (Multi)point-to-multipoint links 90
1.4.3 Host systems (ADM..) 92
1.5 Protection scenario 94
2 PHYSICAL CONFIGURATION 97
2.1 Rack design 97
2.2 1626 LM shelf physical configuration 98
2.2.1 1626 LM Empty shelf 99
2.2.2 1626 LM shelves configuration 100
2.2.3 1626 LM Part list 107
2.2.4 1626 LM shelf front view 121
2.2.5 Boards location constraints 128
2.3 Equipment connections 129
2.3.1 Optical connections 129
2.3.2 Management and maintenance connections 130
2.3.3 Power supply connections 132
2.4 Units front view 132
3 FUNCTIONAL DESCRIPTION 173
3.1 General description 173
3.1.1 Transponder sub-system 180
3.1.2 Optical MUX/DEMUX (Wavelength Division Multiplexing) sub-system 187
3.1.3 Optical Fiber Amplification sub-system 201
3.1.4 Optical supervisory channel (OSC) sub-system 205
3.1.5 Programmable Gain Equalizer (PGE) sub-system 208
3.1.6 Automatic Power Adjustment (APA) sub-system 210
3.1.7 Controller sub-system 212
3.1.8 Power supply sub-system 217
3.1.9 Protection sub-system 219
3.1.10 1626 LM Performance Monitoring sub-system 220
3.1.11 Remote inventory sub-system 225
3.1.12 Frame structure 226
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4 UNITS DESCRIPTION 230
4.1 Tributaries 230
4.1.1 TRBD11x1 (TRiButary Direct - NRZ modulation) 230
4.1.2 TRBC1111 (TRiButary Concentrator - NRZ modulation, VSR, Enhanced FEC) 234
4.1.3 MCC30 (Multi Clock Card - NRZ modulation) 239
4.1.4 SFP optical modules 242
4.2 Multiplexers/demultiplexers 244
4.2.1 CMDX1010 (8:1 and 1:8 Channel Multiplexer / DemultipleXer, 50 GHz grid) 244
4.2.2 BMDX1000 (12:1 and 1:12 Band Multiplexer/DemultipleXer) 248
4.2.3 BMDX1100 (12:1 and 1:12 Band Multiplexer/DemultipleXer for Band OADM) 251
4.2.4 WMAN1X00 (Wavelength MANager) 255
4.2.5 OADC1102 (Optical Add & Drop Coupler) 259
4.2.6 ALCT1010 (Automatic Laser ConTrol) 261
4.2.7 OMDX8100_L1_X (Optical Mux/DemuX in L1 band with expansion) 263
4.2.8 OMDX8100_XX (Optical Mux/DemuX w/o expansion) 266
4.2.9 OMDX4100_XX (Optical Mux/DemuX w/o expansion) 269
4.3 Line Amplifiers 272
4.3.1 LOFA11x0 (Line Optical Fiber Amplifier) 272
4.3.2 Switching protection 278
4.4 Controllers 283
4.4.1 ESCT1000 (Equipment and Shelf ConTroller) 283
4.4.2 XTID1000 (eXTended ID 1000) 284
4.4.3 OSCU1010 (Optical Supervisory Channel Unit) 286
4.4.4 USIB1000 (USer Interfaces Board) 292
4.4.5 HSKU1000 (HouSe Keeping Unit) 295
4.4.6 RAIU1000 (Rack Alarm Interface Unit) 297
4.5 PSUP1000 (Power SUPply card) 301
4.6 FANS1000 303
5 TECHNICAL SPECIFICATIONS 306
5.1 1626 LM system characteristics 306
5.1.1 Main system characteristics 306
5.2 Safety requirements and mechanism 309
5.2.1 Electrical safety 309
5.2.2 Electrical Safety compliance with standardized Norms 309
5.2.3 Optical safety 310
5.3 Boards interfaces characteristics 316
5.3.1 Tributaries optical characteristics 316
5.3.2 Multiplexers / demultiplexers optical characteristics 324
5.4 Alarm characteristics 338
5.5 Power supply characteristics 340
5.5.1 Power consumption 340
5.5.2 Maximum power consumption of the boards and units 340
5.6 Mechanical characteristics 341
5.7 Environmental characteristics 343
5.7.1 Electromagnetic Compatibility (EMC) 343
5.7.2 Electromagnetic Compatibility (EMC) requirements 344
5.7.3 Waste from Electrical and Electronic Equipment (WEEE) 344
5.7.4 Acoustical noise 344
5.7.5 Climatic for operating conditions 345
5.7.6 Storage 348
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5.7.7 Transportation 350
6 HARDWARE SETTINGS 353
6.1 Part Number and Change Status identification 354
6.2 General safety rules and warnings 356
6.3 Microswitches “ON” position 358
6.4 ESCT1000 hardware settings 359
6.5 CMDX1010 hardware settings 360
MAINTENANCE 362
7 MAINTENANCE 364
7.1 Maintenance introduction 364
7.1.1 General safety rules 364
7.2 General rules 365
7.3 Maintenance aspects 365
7.4 Instruments And Accessories 365
7.5 Routine maintenance 366
7.5.1 Routine Maintenance every three months 366
7.5.2 Routine Maintenance every year 366
7.5.3 Routine Maintenance every five years 367
7.6 Corrective maintenance (troubleshooting) 368
7.6.1 FANS1000 substitution 368
7.7 Set of spare parts 369
7.7.1 Suggested Spare Parts 369
7.7.2 General rules on spare parts management 369
7.7.3 Particular rules on spare parts management 369
7.8 Repair Form 370
DISMANTLING & RECYCLING 374
8 DISMANTLING & RECYCLING 376
8.1 WEEE general information 376
8.2 How to disassembly equipment 377
8.2.1 Tools necessary for disassembly 377
8.2.2 Subrack disassembly 378
8.2.3 Unit disassembly 390
8.2.4 Hazardous materials and components 401
8.3 Eco declaration 403
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LIST OF FIGURES AND TABLES
Table 1. Handbooks related to the product’s hardware 14
Table 2. Handbooks related to the specific product SW management and local product control 15
Table 3. Handbooks common to Alcatel Network Elements using 1320CT platform 15
Table 4. Documentation on CD-ROM 16
Table 5. Manuals relative to other equipment required for system setting up 16
Table 6. Handbook configuration check 18
Table 7. IEC 950 -Table 16: Over-temperature limits, Part 2 27
Table 8. Label references 32
Figure 1. Subrack label 33
Figure 2. Subrack label 34
Figure 3. Subrack label 35
Figure 4. Labels on units with standard cover plate 36
Figure 5. Modules label 37
Figure 6. Internal label for Printed Board Assembly 38
Figure 7. Back panels internal label 39
Figure 8. Label specifying item not on catalogue (P/N. and serial number) 40
Figure 9. Label specifying item on catalogue (P/N. and serial number) 40
Figure 10. Item identification labels - item on catalog 41
Figure 11. Label identifying the equipment (example) 41
Figure 12. CE label 42
Figure 13. WEEE label 42
Figure 14. Example of 1626 LM configurations in a WDM line 58
Figure 15. Example of WDM line 61
Figure 16. 1626 LM line terminal configuration on a 50GHZ grid 63
Figure 17. 1626 LM Line Repeater configuration 64
Figure 18. 1626 LM OADM configuration on a 50 GHz grid 65
Figure 19. 1626 LM back-to-back terminal configuration 66
Figure 20. 1626 LM R-OADM configuration 68
Figure 21. 1626 LM line terminal configuration on a 100GHz grid 69
Figure 22. 1626 LM OADM / back to back configuration on a 100 GHz grid 70
Figure 23. Line terminal configuration on a 50 and 100GHz mixed grid + 2 stages amplifier 71
Figure 24. OADM configuration on a 50 and 100GHz mixed grid + 2 stages amplifier 72
Figure 25. Upgrading from OADM to R-OADM on a 50 GHz grid - step 1 73
Figure 26. Upgrading from OADM to R-OADM on a 50 GHz grid - step 2 74
Figure 27. Upgrading from OADM to R-OADM on a 100 GHz grid - step 1 75
Figure 28. Upgrading from OADM to R-OADM on a 100 GHz grid - step 2 76
Figure 29. Generic example of LT configuration in point-to-point application 77
Figure 30. Upgrade of the 1640 WM based on TCS401 in line terminal configuration 78
Figure 31. Upgrade of the 1640 WM based on MDX in line terminal configuration 79
Figure 32. 1686 WM system upgrade with 1626 LM transponders in Line Terminal configuration 80
Figure 33. 1686 WM system upgrade with the 1626 LM mux/demux scheme in LT configuration 81
Figure 34. The 1626 LM in point-to-point links 82
Figure 35. The 1626 LM in linear (multipoint-to-multipoint) links 82
Figure 36. The 1626 LM in ring (multipoint-to-multipoint) networks 83
Figure 37. Connection to host equipments 84
Figure 38. Optical channel protection in linear links 85
Figure 39. Optical SNCP protection scheme: with back-to-back terminals or OADM 86
Figure 40. Optical protection way of working 86
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Figure 41. Rack organization 88
Figure 42. Shelf dimensions and slots numbering 89
Figure 43. Example of master shelf configuration in Line Terminal application (50GHz grid) 92
Figure 44. Example of a slave/transponder shelf configuration (50GHz grid) 92
Figure 45. Example of a transponder shelf configuration 93
Figure 46. Example of master shelf in OADM configuration 93
Figure 47. Example of master shelf in OADM configuration (upgradable to 23 dBm, 50GHz grid) 94
Figure 48. Example of R-OADM master shelf configuration (20 dBm max), on 50GHz grid 94
Figure 49. Example of R-OADM master shelf configuration (upgradable to 23 dBm), 50GHz grid 95
Figure 50. Example of R-OADM tributary shelf configuration (upgradable to 23 dBm), 50GHz grid 95
Figure 51. Line Terminal on 100GHz grid: master shelf configuration, one LOFA per direction 96
Figure 52. OADM on 100GHz grid: master shelf configuration with vertical amplifiers 96
Figure 53. OADM on 100GHz grid: master shelf configuration with horizontal amplifiers 97
Table 9. 1626 LM boards and units list 99
Table 10. 1626 LM explanatory notes 109
Figure 54. Example of Master and slave shelves front view in Line Terminal configuration (LH) 112
Figure 55. Example of 1626 LM in Line Terminal configuration with 40 channels (LH) 113
Figure 56. Example of Master shelf front view in OADM configuration (+20 dBm max) - LH 114
Figure 57. Example of Master shelf in OADM configuration (upgradable to +23 dBm) - LH 114
Figure 58. Example of Master shelf front view in Line Repeater configuration 115
Table 11. ALCT location constraints with respect to BMDX (for use in dynamic mode only) 116
Table 12. ALCT location constraints with respect to OADC (for use in dynamic mode only) 116
Table 13. USIB1000 location constraints with respect to OSCU101x 116
Figure 59. Double MU optical connector 117
Figure 60. LC/SPC optical connector 118
Figure 61. Examples of intra-shelf links (with 10Base-2 and 10Base-T interface) 119
Figure 62. TRBD11X1 board front panel 121
Figure 63. TRBC1111 board front panel 122
Figure 64. MCC30 board front panel 123
Figure 65. CMDX1010 board front panel 124
Figure 66. BMDX1X00 board front panel 125
Figure 67. WMAN1100 front panel 126
Figure 68. OADC1102 front panel 127
Figure 69. ALCT1010 front panel 128
Figure 70. OMDX8100_L1_X board front panel 129
Figure 71. OMDX8100_xx front panel 130
Figure 72. OMDX4100 front panel 131
Figure 73. OCPU2104 front panel 132
Figure 74. LOFA11xx front panel 133
Figure 75. ESCT1000 front panel 134
Figure 76. OSCU1010 front panel 135
Figure 77. OSCU1011 front panel 136
Figure 78. HSKU1000 front panel 137
Figure 79. RAIU1000 front panel 138
Figure 80. USIB1000 front panel 139
Figure 81. PSUP1000 front panel 140
Figure 82. FANS1000 front panel 141
Figure 83. SFP optical module 142
Figure 84. Line Terminal - LH 146
Figure 85. Line Terminal - Regional 147
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Figure 86. Line Repeater 148
Figure 87. Optical Add and Drop Multiplexer repeater - LH 149
Figure 88. Back-to-back terminal - LH 150
Figure 89. Transponder sub-system in O-SNCP configuration (future rel.) 152
Table 14. Frequencies plan for Metropolitan applications (50 and 100GHz mixed grid) 154
Figure 90. 50 GHz grid Mux/Demux sub-system in Line Terminal configuration 157
Table 15. Nominal frequencies allocation plan in C-Band for long haul applications (50GHz grid) 159
Figure 91. 4 and 8 channels DWDM optical MUXes 162
Figure 92. LB and SB aggregate signals expansion MUX 162
Figure 93. 4 and 8 channels optical DMUX 163
Figure 94. LB and SB aggregate signals expansion DEMUX 163
Figure 95. MUX and DMUX functions of an 8 channels Line Terminal 164
Figure 96. MUX and DMUX functions of a 12 channels Line Terminal 164
Figure 97. MUX and DMUX functions of a 32 channels Line Terminal 165
Figure 98. MUX and DMUX functions of an 8 channels OADM 165
Figure 99. MUX and DMUX functions of a 32 channels back-to-back terminal 166
Table 16. Frequencies allocation plan in C-Band for Metropolitan applications (100GHz grid) 167
Figure 100. Generic unidirectional block scheme of a 2-stage amplifier with interstage access 168
Figure 101. Generic bidirectional block scheme of a 2-stage amplifier 169
Figure 102. Optical amplification in back-to-back / OADM configuration (bidirectional) 169
Figure 103. Optical amplification in back-to-back / OADM configuration (unidirectional) 170
Figure 104. Optical amplification in Line Repeater configuration 171
Figure 105. Optical amplification in Line Terminal configuration 171
Figure 106. Remote supervision through OSC 172
Figure 107. Example of Optical Supervisory Channel management in linear links 173
Figure 108. PGE sub-system block diagram 174
Figure 109. Controller sub-system 179
Figure 110. Example of control interfaces scheme 180
Figure 111. 1626 LM - equipment power supply scheme 182
Table 17. Boards and supported Performance Monitoring Points 185
Figure 112. Example of possible monitored sections 185
Table 18. RS default threshold data values 187
Table 19. Performance Domain alarms 187
Figure 113. Remote Inventory sub-system 188
Figure 114. Optical Transport Hierarchy (OTH) frame structure 190
Figure 115. Multiplexing of four ODU1 into a ODU2 191
Figure 116. G.709/Y.1331 - OTUk frame structure 192
Figure 117. TRBD11x1 unit block diagram 193
Figure 118. Loop-backs on TRBD1111, TRBD1121 and TRBD1131 196
Figure 119. TRBC1111 unit block diagram 197
Figure 120. Multiplexing of 4 ODU1 into an ODU2 200
Figure 121. Loop-backs on TRBC1111 201
Figure 122. MCC30 unit block diagram 202
Figure 123. MCC30 in default configuration (no cross-connection) 205
Figure 124. Add/Drop configuration, without Optical-SNCP (identical 8x8 matrix configuration) 206
Table 20. Consequent actions in ingress (B&W to WDM) and egress /(WDM to B&W) directions 206
Figure 125. Add/Drop with Optical-SNCP (identical 8x8 matrix configuration) 207
Figure 126. Pass-through (regeneration configuration) 207
Table 21. Combinations of loopbacks and cross-connection settings: loopback configurations names 208
Figure 127. Local Loopback 208
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Figure 128. User Loopback 209
Figure 129. User Loopback & pass-through 209
Figure 130. Remote Loopback in ring application (back-to-back or OADM) 210
Figure 131. Remote Loopback and Add/Drop in ring application (back-to-back or OADM) 210
Figure 132. Remote Loopback & pass-through 211
Figure 133. SFP optical module block diagram 213
Figure 134. CMDX1010 block diagram 214
Figure 135. BMDX1000 block diagram 217
Table 22. Multiplexed/demultiplexed channels by BMDX1000 (50GHz) and band centre frequency 219
Figure 136. BMDX1100 block diagram 220
Table 23. Multiplexed/demultiplexed channels by BMDX1000 (50GHz) and band centre frequency 222
Figure 137. WMAN1X00 block diagram 223
Figure 138. Wavelength blocker function diagram 224
Figure 139. OADC1102 block diagram 226
Figure 140. ALCT1010 block diagram 228
Figure 141. OMDX8100_L1_X block diagram 230
Figure 142. OMDX8100_XX block diagram 233
Figure 143. OMDX4100_XX block diagram 235
Figure 144. LOFA11x0 block diagram 237
Figure 145. LOFA11x1 block diagram 238
Figure 146. OCPU2104 block diagram 241
Figure 147. O-SNCP: full TRBD configuration 242
Figure 148. O-SNCP: full TRBC configuration 243
Figure 149. O-SNCP: TRBC and TRBD mixed configuration 243
Figure 150. O-SNCP: 32 + 32 ch. full TRBD configuration 244
Figure 151. ESCT1000 block diagram 245
Figure 152. OSCU1010 block diagram 247
Figure 153. SPVM board in a Line Terminal configuration 250
Figure 154. OSCU board in an OADM or Back-To-Back configuration 250
Figure 155. USIB1000 block diagram 251
Figure 156. Interconnection between USIB and OSCU via back panel for 64Kbps and 2Mbps 252
Figure 157. HSKU1000 block diagram 254
Figure 158. RAIU1000 block diagram 256
Table 24. Front Panel LEDs severity meaning 258
Figure 159. Electrical links between RAIU cards and TRU 259
Figure 160. PSUP1000 block diagram 260
Figure 161. FANS1000 block diagram 261
Figure 162. Fan shelf description and Rack partitioning 262
Figure 163. AEL for Class 1 between 1500 nm and 1800 nm 269
Figure 164. AEL for Class 1M between 1500 nm and 1800 nm 270
Table 25. AEL at 980 and 1480 nm for Hazard Levels 1 and 1M 270
Figure 165. Example of line failure between two Line Repeaters 273
Table 26. ALCT1010 wavelengths list 287
Table 27. Relation between Alarm severity terminology displayed on C.T./O.S. and alarm severity
terminology used for the ESCT leds and ETSI market racks (TRU). 295
Figure 166. Climatogram for Class 3.2 : Partly temperature controlled locations 303
Table 28. Environmental Operating Conditions [1] 304
Figure 167. Climatogram for Class 1.2: not temperature controlled storage location 306
Table 29. Transportation climatic 308
Table 30. Example of ANV Part Number + ICS evolution 312
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Figure 168. Microswitch front view and meaning 315
Figure 169. ESCT1000 hardware settings 316
Table 31. ESCT1000 presetting table 316
Figure 170. CMDX1010 hardware settings 317
Table 32. CMDX1010 presetting table 317
Figure 171. Repair form 327
Figure 172. Subrack front and rear view 333
Figure 173. Handle removing and disassembly 334
Figure 174. Rear cover removing 335
Figure 175. Back Panel removing 336
Figure 176. Upper and lower guides plane removing 337
Figure 177. Side wall removing 338
Figure 178. Optical fiber duct, guides and contact spring removing 339
Figure 179. Side coverplate removal 340
Figure 180. Levers removal 341
Figure 181. Optical connectors support removal 342
Figure 182. Side coverplate and contact spring removal 343
Figure 183. Internal connectors removal 344
Figure 184. Dissipator removal 345
Figure 185. Modules removal from dissipator 346
Figure 186. Daughter boad removal 346
Figure 187. Gold connector removal 347
Figure 188. Internal cables removal 348
Figure 189. Connector metal support removal 349
Table 33. List of hazardous materials and components present in the equipment 350
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